PALLUNA® 452 is a weakly ammoniacal electrolyte for the deposition of palladium in continuous systems and rack plating. It is used...
Pure palladium electrolyte with excellent bonding and solderability
PALLUNA® 452 is a weakly ammoniacal electrolyte for the deposition of palladium in continuous systems and rack plating. It is used especially where excellent bondability and solderability are required.
The electrolyte has already been used for years in semiconductor technology and is mainly used in selective high-speed deposition. It is particularly suitable for systems with immersion cells, belt cells, brush cells, jet and spot systems.
Electrolytes Characteristics
| Electrolyte type | weakly ammoniacal |
| Metal content | 3 (2.5 - 7) g/l Pd |
| pH value | 8.0 (7.5 - 8.4) |
| Operating temperature | 55 (50 - 60) °C |
| Current density range | 1 - 2 A/dm² |
| Plating speed | ca. 0.25 μm/min bei 1 A/dm² ca. 0.50 μm/min bei 2 A/dm² |
| Anode material | PLATINODE® 167 |
Coating Characteristics
| Coating | Pure palladium |
| Purity | 99.9 wt.% Pd |
| Colour of deposit | white |
| Brightness | matt |
| Max. coating thickness | approx. 0.3 μm |
| Density of the coating | approx. 12 g/cm³ |
Advantages
- Excellent bonding and solderability
- High deposition rate
- Simple electrolyte feed
- For continuous lines and rack plating
Applications
- Lead frames
